Power reduction for a sensing operation of a memory cell

ABSTRACT

Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory device may leverage non-volatile memory properties of a ferroelectric capacitor—e.g., that a ferroelectric capacitor may remain polarized at one of two states without a voltage applied across the ferroelectric capacitor—to activate a subset of sensing components corresponding to multiple memory cells with a common word line. For example, a first and second set of memory cells with a common word like may be selected for a read operation. A first set of sensing components corresponding to the first set of memory cells may be activated for the read operation, and a second set of sensing components that correspond to the second set of memory cells may be maintained in a deactivated state.

BACKGROUND

The following relates generally to memory devices and more specificallyto reducing the power consumption associated with read operations for aferroelectric memory cell.

Memory devices are widely used to store information in variouselectronic devices such as computers, wireless communication devices,cameras, digital displays, and the like. Information is stored byprograming different states of a memory device. For example, binarydevices have two states, often denoted by a logic “1” or a logic “0.” Inother systems, more than two states may be stored. To access the storedinformation, the electronic device may read, or sense, the stored statein the memory device. To store information, the electronic device maywrite, or program, the state in the memory device.

Various types of memory devices exist, including random access memory(RAM), read only memory (ROM), dynamic RAM (DRAM), synchronous dynamicRAM (SDRAM), ferroelectric RAM (FeRAM), magnetic RAM (MRAM), resistiveRAM (RRAM), flash memory, and others. Memory devices may be volatile ornon-volatile. Non-volatile memory (e.g., flash memory) can store datafor extended periods of time even in the absence of an external powersource. Volatile memory devices (e.g., DRAM) may lose their stored stateover time unless they are periodically refreshed by an external powersource. A binary memory device may be an example of a volatile memorydevice and may store a logic state by charging or discharging acapacitor. A charged capacitor, however, may become discharged over timethrough leakage currents, resulting in the loss of the storedinformation. Furthermore, reading the state stored in a capacitor isdestructive and the memory device must rewrite the initial state to thecapacitor at the end of the read operation. Certain features of volatilememory may offer performance advantages, such as faster read or writespeeds, while features of non-volatile memory, such as the ability tostore data without periodic refreshing, may be advantageous.

FeRAM may use similar device architectures as volatile memory but mayhave non-volatile properties due to the use of a ferroelectric capacitoras a storage device. FeRAM devices may thus have improved performancecompared to other non-volatile and volatile memory devices. Whenperforming a read operation, an FeRAIVI device may activate the sensingcomponents corresponding to each memory cell with a common word line.But firing each memory cell may result in increased power consumption.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure herein refers to and includes the following figures:

FIG. 1 illustrates an example memory array that supports a reduced-powersensing scheme in accordance with various embodiments of the presentdisclosure;

FIG. 2 illustrates an example circuit of a memory cell that supports areduced-power sensing scheme in accordance with various embodiments ofthe present disclosure;

FIG. 3 illustrates example hysteresis curves for a ferroelectric memorycell that supports a reduced-power sensing scheme in accordance withvarious embodiments of the present disclosure;

FIG. 4 illustrates an example circuit that supports a reduced-powersensing scheme in accordance with various embodiments of the presentdisclosure;

FIG. 5 illustrates a timing diagram for a reduced-power sensing schemein accordance with various embodiments of the present disclosure;

FIG. 6 illustrates an example memory controller for a reduced-powersensing scheme in accordance with various embodiments of the presentdisclosure;

FIG. 7 illustrates a block diagram of an example ferroelectric memoryarray that supports a reduced-power sensing scheme in accordance withvarious embodiments of the present disclosure;

FIG. 8 illustrates a block diagram of a device, including a memoryarray, that supports a reduced-power sensing scheme in accordance withvarious embodiments of the present disclosure; and

FIG. 9 is a flowchart that illustrates a method or methods for areduced-power sensing scheme in accordance with various embodiments ofthe present disclosure.

DETAILED DESCRIPTION

A ferroelectric memory device may leverage non-volatile memoryproperties of a ferroelectric capacitor—e.g., that a ferroelectriccapacitor may remain polarized at one of two states without a voltageapplied across the ferroelectric capacitor—to activate a subset ofsensing components corresponding to multiple memory cells using a commonaccess line (e.g., a word line), conserving power. A set of memorycells, associated with a common word line, may be selected for a readoperation. The read operation may be performed to extract informationstored by some memory cells of the set of memory cells withoutdisturbing information stored in other memory cells of the set, eventhough each memory cell in the set may share a word line.

By way of example, to read memory cells of a set, digit linescorresponding to the memory cells to be read may be virtually groundedbefore the read operation. A voltage may be applied to top cell plate ofmemory cells to be read. This may cause a voltage difference acrossferroelectric capacitors of the cells to be read, so the ferroelectriccapacitors may release charge onto the corresponding digit lines duringthe read operation. To prevent the ferroelectric capacitors of othermemory cells—i.e., those not intended to be read—from releasing charge,a voltage across those ferroelectric capacitors may be held at or nearzero. For instance, digit lines corresponding to unread memory cells maybe maintained at a voltage that is at or near a voltage applied to a topcell plate of the ferroelectric capacitors of the unread memory cells.Accordingly, the ferroelectric capacitors of the unread memory cells mayretain their stored logic states during a read operation of other cellson the same word line, and the sensing components associated with theunread memory cells may be maintained in a deactivated state, which mayreduce power consumption.

By contrast, for a DRAM memory cell, selecting a memory cell for a readoperation may disturb each memory cell that shares a word line. Asdescribed further below, the sensing components may then be used torestore (“write-back”) the initial logic state of the disturbed memorycells, drawing power to facilitate the write-back.

Features of the disclosure introduced above are further described belowin the context of a memory array. Specific examples are then describedwith reference to a circuit that supports a reduced power sensingarchitecture. These and other features of the disclosure are furtherillustrated by and described with reference to apparatus diagrams,system diagrams, and flowcharts that relate to a reduced power sensingscheme.

FIG. 1 illustrates an example memory array 100 that supports areduced-power sensing scheme in accordance with various embodiments ofthe present disclosure. Memory array 100 may also be referred to as anelectronic memory apparatus. Memory array 100 includes memory cells 105that are programmable to store different states. Each memory cell 105may be programmable to store two states, denoted as a logic “0” and alogic “1.” In some cases, memory cell 105 is configured to store morethan two logic states. A memory cell 105 may include a capacitor tostore a charge representative of the programmable states; for example, acharged and uncharged capacitor may represent two logic states,respectively. DRAM architectures may commonly use such a design, and thecapacitor employed may include a dielectric material with linearelectric polarization properties. By contrast, a ferroelectric memorycell may include a capacitor that has a ferroelectric as the dielectricmaterial. Different levels of charge of a ferroelectric capacitor mayrepresent different logic states. Ferroelectric materials havenon-linear polarization properties; some details and advantages of aferroelectric memory cell 105 are discussed below.

Operations such as reading and writing may be performed on memory cells105 by activating or selecting the appropriate access line, which mayalso be referred to as a word line 110 and digit line 115 from WL_1 toWL_N and DL_1 to DL_N, respectively. Activating or selecting a word line110 or a digit line 115 may include applying a voltage to the respectiveline. In some cases, a digit line 115 may be referred to as a bit line.Word lines 110 and digit lines 115 are made of conductive materials. Forexample, word lines 110 and digit lines 115 may be made of metals, suchas copper, aluminum, gold, tungsten, or the like. According to theexample of FIG. 1, each row of memory cells 105 are connected to asingle word line 110, and each column of memory cells 105 are connectedto a single digit line 115. By activating (e.g., applying a voltage to)one of the word lines 110 and one of the digit lines 115, a singlememory cell 105 may be accessed at their intersection. The intersectionof a word line 110 and digit line 115 may be referred to as an addressof a memory cell.

In some architectures, the logic-storing device of a cell (e.g., acapacitor) may be electrically isolated from the digit line by aselection component. The word line 110 may be connected to and maycontrol the selection component. For example, the selection componentmay be a transistor and the word line 110 may be connected to the gateof the transistor. Activating the word line 110 results in an electricalconnection or closed circuit between the capacitor of a memory cell 105and its corresponding digit line 115. The digit line may then beaccessed to either read or write the memory cell 105. Accessing memorycells 105 may be controlled through a row decoder 120 and a columndecoder 130. In some examples, a row decoder 120 receives a row addressfrom the memory controller 140 and activates the appropriate word line110 based on the received row address. Similarly, a column decoder 130receives a column address from the memory controller 140 and activatesthe appropriate digit line 115. Thus, by activating a word line 110 anda digit line 115, memory cell 105 may be accessed. For example, thememory array 100 may access memory cell 105 by activating DL_1 and WL_3.

Upon accessing, memory cell 105 may be read, or sensed, by sensingcomponent 125 to determine the stored state of memory cell 105. Forexample, after accessing the memory cell 105, the ferroelectriccapacitor of memory cell 105 may discharge onto the corresponding digitline 115, inducing a voltage on the digit line 115. The voltage of thedigit line 115 may be input to the sensing component 125, where thevoltage of the digit line 115 may be compared with a reference voltage.For a memory cell 105 with a ferroelectric capacitor, reading the memorycell may include biasing—e.g., applying a voltage to—a plate of theferroelectric capacitor. This may be referred to as a “moving plate”scheme. In some cases, a fixed voltage may be applied to the plate ofthe ferroelectric capacitor, and reading the memory cell may includevirtually grounding a digit line 115 that is in electronic communicationwith the ferroelectric capacitor prior to performing a read operation.This may be referred to as a “fixed plate” scheme.

Sensing component 125 may include various transistors or amplifiers todetect and amplify a difference in the signals, which may be referred toas latching. Sensing component 125 may include a sense amplifier thatreceives and compares a voltage of a digit line 115 and a referencevoltage. The output of the sense amplifier may be driven to a higher(e.g., a positive) or lower (e.g., negative or ground) supply voltagebased at least in part on the comparison. For instance, if digit line115 has a higher voltage than the reference voltage, then the senseamplifier output may be driven to a positive supply voltage. In somecases, the sense amplifier may additionally drive the output of thedigit line 115 to the supply voltage. Sensing component 125 may thenlatch the output of the sense amplifier or the voltage of digit line115, or both, which may be used to determine that the stored state inmemory cell 105 was a logic “1.” Alternatively, if digit line 115 has alower voltage than the reference voltage, the sense amplifier output maybe driven to a negative or ground voltage. Sensing component 125 maysimilarly latch the output of the sense amplifier to determine that thestored state in memory cell 105 was a logic “0.” The detected logicstate of memory cell 105 may then be output through column decoder 130as output 135.

A memory cell 105 may be set, or written, by activating the relevantword line 110 and digit line 115. As discussed above, activating a wordline 110 electrically connects the corresponding row of memory cells 105to their respective digit lines 115. By controlling the relevant digitline 115 while the word line 110 is activated, a memory cell 105 may bewritten—i.e., a logic value may be stored in the memory cell 105. Columndecoder 130 may accept data, for example input 135, to be written to thememory cells 105. A ferroelectric memory cell 105 may be written byapplying a voltage across the ferroelectric capacitor. This process isdiscussed in more detail below.

In some memory architectures, accessing the memory cell 105 may degradeor destroy the stored logic state, and re-write or refreshoperation—also referred to as a write-back operation—may be performed toreturn the original logic state to memory cell 105. In DRAM, forexample, a capacitor may be initialized with one of two states, a logic“0” or a logic “1.” For instance, a logic “0” may be associated with anegative or zero voltage across a capacitor, and a logic “1” may beassociated with a positive voltage across the capacitor. A DRAM readoperation may include providing a voltage that is half of a sensingvoltage to a digit line 115 that is in electronic communication with afirst plate (e.g., a bottom plate) of a capacitor and floating the digitline 115 prior to accessing a memory cell 105. Upon accessing the memorycell 105, and due to the voltage of the first plate and the voltageacross the capacitor, the capacitor may be partially or completelydischarged onto or be charged from the digit line 115, depending on thestored state. Therefore, accessing the memory cell may corrupt ordisturb the stored logic state, and the logic state may be re-writtenafter a sense operation.

To re-write the logic state, a sensing component 125 may apply a highvoltage (e.g., a full sense voltage) or a low voltage (e.g., virtualground) to the first plate of the capacitor, while a voltage of thesecond plate (e.g., a top plate) is maintained at a fixed voltage (e.g.,half of the sensing voltage). During this period, the voltage appliedacross the capacitor may correspond to either a logic “0” or a logic“1,” and the memory cell may be isolated from the digit line 115 tostore the logic state. In some cases, a single word line 110 is inelectronic communication with multiple memory cells 105, and activatingthe single word line 110 for a read operation may result in thedischarging or charging of the memory cells 105 in the row. So severalor all memory cells 105 in the row may need to be re-written. In a DRAMdevice, sensing components 125 that corresponding to accessed memorycells 105, may be used to re-write the initially stored logic statesback to the memory cells 105 accessed by the read operation.

Some memory architectures, including DRAM, may also lose their storedstate over time unless they are periodically refreshed by an externalpower source. For example, a charged capacitor may become dischargedover time through leakage currents, resulting in the loss of the storedinformation. The refresh rate of these so-called volatile memory devicesmay be relatively high—e.g., tens of refresh operations per second forDRAM—which may result in significant power consumption. Withincreasingly larger memory arrays, increased power consumption mayinhibit the deployment or operation of memory arrays (e.g., powersupplies, heat generation, material limits, etc.), especially for mobiledevices that rely on a finite power source, such as a battery.Ferroelectric memory cells 105 may, however, have beneficial propertiesthat may result in improved performance relative to other memoryarchitectures. For example, because ferroelectric memory cells 105 tendto be less susceptible to degradation of stored charge, a memory array100 that employs ferroelectric memory cells 105 may require fewer or norefresh operations, and may thus require less power to operate.

In some examples, the non-volatile properties of a ferroelectriccapacitor may be used to maintain the state stored by a ferroelectricmemory cell 105, while a voltage is applied to a word line 110 used by aferroelectric memory cell 105. For instance, a memory array 100 mayleverage the property of a ferroelectric capacitor to retain apolarization charge, and therefore a stored logic state while a zerovoltage is applied across the ferroelectric capacitor during a readoperation, as illustrated in FIG. 3. With regard to a ferroelectricmemory cell 105 that uses a fixed plate scheme, a fixed voltage may beapplied to a first plate (“top” plate) of a ferroelectric capacitorassociated with the ferroelectric memory cell 105, and a correspondingdigit line 115 may be charged to a voltage whose magnitude is at or nearthe fixed voltage. The corresponding digit line 115 may be in electroniccommunication with a second plate (“bottom” plate) of the ferroelectriccapacitor. A voltage may then be applied to a word line 110 that is usedby and common to the ferroelectric memory cell 105 and otherferroelectric memory cells 105.

In some cases, a read operation may be initiated in order to read asubset of the ferroelectric memory cells 105; however, as discussedabove, applying a voltage to a word line 110 may result in each of theferroelectric memory cells 105 using the word line 110 being accessed.For the subset of the ferroelectric memory cells 105 intended to beread, the corresponding digit lines 115 may be virtually grounded beforeapplying the voltage to the word line 110. For other ferroelectricmemory cells 105 that are not intended to be read, the correspondingdigit lines may be maintained at the fixed voltage applied to the first(“top”) plate of the ferroelectric capacitor. Therefore, when the unreadferroelectric memory cells 105 are accessed by the read operation, azero voltage differential—i.e., the voltage of the top plate minus thevoltage of the bottom plate—may be applied across the associatedferroelectric capacitors.

Thus, the ferroelectric capacitors associated with the second set offerroelectric memory cells 105 may refrain from sharing charge with thedigit lines 115. And due to the ability of a ferroelectric capacitor tomaintain at least two different logic states while a zero voltage isapplied across the ferroelectric capacitor, the stored logic states maybe maintained. By contrast, a capacitor used by a DRAM memory cell 105may not maintain its stored state at a zero voltage differential andtherefore may need to be re-written after each read operation on theword line. Because the logic state does not need to be written-back to aferroelectric memory cell after each read operation, the sensingcomponents 125 corresponding to the associated ferroelectric capacitormay be maintained in a deactivated state to conserve power.

The memory controller 140 may control the operation (e.g., read, write,re-write, refresh, etc.) of memory cells 105 through the variouscomponents, such as row decoder 120, column decoder 130, and sensingcomponent 125. Memory controller 140 may generate row and column addresssignals in order to activate the desired word line 110 and digit line115. Memory controller 140 may also generate and control various voltagepotentials used during the operation of memory array 100. In general,the amplitude, shape, or duration of an applied voltage discussed hereinmay be adjusted or varied and may be different for the variousoperations for operating memory array 100. Furthermore, one, multiple,or all memory cells 105 within memory array 100 may be accessedsimultaneously; for example, multiple or all cells of memory array 100may be accessed simultaneously during a reset operation in which allmemory cells 105, or a group of memory cells 105, are set to a singlelogic state.

In some cases, memory controller 140 may be used to activate a first setof switching components 125, a second set of switching components 125,or both. For instance, in some cases, a set of memory cells 105 using acommon word line 110 may be grouped into a first and second set ofmemory cells 105. Memory controller 140 may be used to select the firstset of memory cells 105 and the second set of memory cells 105 for aread operation using the common word line 110; but may individuallyactivate a corresponding first and second set of sensing components 125.That is, memory controller 140 may activate the first set of sensingcomponents 125 for the first set of memory cells 105, while maintainingthe second set of sensing components corresponding to the second set ofmemory cells in a deactivated state during the read operation. Operatinga portion of the sensing components 125 corresponding to the first andsecond set of memory cells 105 may conserve power and may be used toreduce noise in memory array 100, such as pattern noise, cross-talkbetween digit lines 115, and the like.

FIG. 2 illustrates an example circuit 200 of a memory cell that supportsa reduced power sensing scheme in accordance with various embodiments ofthe present disclosure. Circuit 200 includes a memory cell 105-a, wordline 110-a, digit line 115-a, and sensing component 125-a, which may beexamples of a memory cell 105, word line 110, which may also be referredto as access line, digit line 115, and sensing component 125,respectively, as described with reference to FIG. 1.

Memory cell 105-a may include a logic storage component, such ascapacitor 205, which has a first plate and a second plate that arecapacitively coupled. The first plate may be referred to as cell plate230 and the second plate may be referred to as cell bottom 215. In someexamples, the orientation of the capacitor may be flipped withoutchanging the operation of memory cell 105-a; that is, the first platemay correspond to cell bottom 215 and the second plate may correspond tocell plate 230. In the example of FIG. 2, cell plate 230 may be accessedvia plate line 210 and cell bottom 215 may be accessed via digit line115-a. Also, in the example of FIG. 2, the terminals of capacitor 205are separated by a ferroelectric material, and memory cell 105-a isreferred to as a ferroelectric memory cell 105-a in the followingdiscussion. As described above, various states may be stored by chargingor discharging capacitor 205, i.e., polarizing the ferroelectricmaterial of capacitor 205. The total charge needed to polarize capacitor205 may be referred to as the remnant polarization (PR) value, and avoltage of capacitor 205 at which half the total charge of capacitor 205is reached may be referred to as the coercive voltage (VC).

The stored state of capacitor 205 can be read or sensed by operatingvarious elements represented in circuit 200. Capacitor 205 may be inelectronic communication with digit line 115-a. For example, capacitor205 can be isolated from the digit line 115-a when selection component220 is deactivated, and capacitor 205 can be connected to digit line115-a when selection component 220 is activated to select theferroelectric memory cell 105-a. In other words, ferroelectric memorycell 105-a may be selected using selection component 220 that is inelectronic communication with ferroelectric capacitor 205, whereferroelectric memory cell 105-a includes selection component 220 andferroelectric capacitor 205. In some cases, selection component 220 is atransistor and its operation is controlled by applying a voltage to thetransistor gate, where the voltage magnitude is greater than thethreshold magnitude of the transistor.

Word line 110-a may activate selection component 220; for example, avoltage applied to word line 110-a is applied to the transistor gate,connecting capacitor 205 with digit line 115-a. Alternatively, thepositions of selection component 220 and capacitor 205 may be switched,such that selection component 220 is between plate line 210 and cellplate 230 and such that capacitor 205 is between digit line 115-a andthe other terminal of selection component 220. In such cases, selectioncomponent 220 may remain in electronic communication digit line 115-a tocapacitor 205. This configuration may be associated with alternativetiming and biasing for read and write operations.

Due to the ferroelectric material between the plates of capacitor 205,and as discussed in more detail below, capacitor 205 may not dischargeupon connection to digit line 115-a. For example, to sense the statethat is stored by ferroelectric capacitor 205 during a read, plate line210 may be ramped to a voltage in a moving plate scheme. In some cases,digit line 115-a is virtually grounded and subsequently isolated fromthe virtual ground before ramping the voltage to plate line 210 andapplying a voltage to word line 110-a to select ferroelectric memorycell 105-a. Selecting ferroelectric memory cell 105-a may result in avoltage difference across capacitor 205—e.g., the voltage of plate line210 minus the voltage of digit line 115-a. The resulting voltagedifference may yield a change in the stored charge on capacitor 205depending on the initial state of capacitor 205—e.g., whether theinitial state stored a logic “1” or a logic “0.” This change in storedcharge may induce a voltage on digit line 115-a based on the resultingcharge stored on capacitor 205. The induced voltage on digit line 115-amay then be compared to a reference (e.g., a voltage of reference line225) by sensing component 125-a in order to determine the stored logicstate in ferroelectric memory cell 105-a.

Alternatively (e.g., in a fixed plate scheme), a non-variable voltagemay be applied to plate line 210—e.g., the fixed voltage may be half ofthe voltage supplied to sensing component 125-a. That is, the voltageapplied to plate line 210 may be maintained at a pre-determined voltage.In such cases, inactive digit lines, such as digit line 115-a, may becharged to a voltage that is associated with (e.g., the same as or near)the fixed voltage applied to plate line 210. In order to sense the logicstate stored by capacitor 205, digit line 115-a may be virtuallygrounded and subsequently isolated from virtual ground prior to applyinga voltage to word line 110-a. As above, applying the voltage to wordline 110-a may establish a conductive path between cell bottom 215 anddigit line 115-a resulting in a voltage difference across capacitor205—e.g., the fixed voltage of cell plate 230 minus the voltage of digitline 115-a. Capacitor 205 may then charge share with digit line 115-aand a voltage may be induced. In some cases, this induced voltage may becompared with a reference voltage at sensing component 125-a.

In some examples, word line 110-a may be used to select multipleferroelectric memory cells including ferroelectric memory cell 105-a fora read operation. The read operation may be triggered for the purpose ofreading a subset of the selected ferroelectric memory cells. And in someexamples, memory cell 105-a may not be included in the subset ofselected ferroelectric memory cells. Accordingly, digit line 115-a maybe maintained at or near the voltage applied to plate line 210 tomaintain the polarization state of capacitor 205 and retain the storedlogic state. Furthermore, since the logic state of memory cell 105-a maybe undisturbed during the read operation, a memory device may conservepower by activating only the sensing components associated with thesubset of the selected ferroelectric memory cells, as described in moredetail below.

Although the above techniques have largely been discussed in the contextof a fixed plate scheme, these principles and the following discussionherein may similarly be applied to a moving plate scheme. For instance,the voltage of digit line 115-a may be ramped in unison with and at thesame magnitude of a voltage applied to plate line 210 for a readoperation. Alternatively, the voltage of digit line 115-a may be biasedat the peak of the ramped voltage applied to plate line 210.

The specific sensing scheme or process employed to read cell 105-a maytake many forms. In one example, digit line 115-a may have an intrinsiccapacitance and develop a non-zero voltage as capacitor 205 charges ordischarges in response to the voltage applied to plate line 210. Theintrinsic capacitance may depend on physical characteristics, includingthe dimensions, of digit line 115-a. Digit line 115-a may connect manyferroelectric memory cells 105, so digit line 115-a may have a lengththat results in a non-negligible capacitance (e.g., on the order ofpicofarads (pF) or femtofarads (fF)). The subsequent voltage of digitline 115-a may depend on the initial logic state of capacitor 205, andsensing component 125-a may compare this voltage to a voltage onreference line 225 provided by a reference component. Other sensingprocesses that take advantage of this change in charge may also be used.

To write ferroelectric memory cell 105-a, a voltage may be appliedacross capacitor 205. Various methods may be used. In one example,selection component 220 may be activated through word line 110-a inorder to electrically connect capacitor 205 to digit line 115-a. Avoltage may be applied across capacitor 205 by controlling the voltageof cell plate 230 using plate line 210 and controlling the voltage ofcell bottom 215 using digit line 115-a. To write a logic “0,” cell plate230 may be taken high, that is, a positive voltage may be applied toplate line 210, and cell bottom 215 may be taken low—e.g., virtuallygrounded using digit line 115-a. The opposite process is performed towrite a logic “1”—i.e., cell plate 230 may be taken low and cell bottom215 may be taken high.

In a scheme in which a fixed voltage is applied to plate line 210,selection component 220 may be activated and a voltage applied to digitline 115-a may be used to control the voltage of cell bottom 215 for awrite operation. In some cases, the fixed plate voltage may be betweenthe supply voltages of sensing component 125-a, and sensing component125-a may be used to drive the voltage of digit line 115-a to a voltagethe high or the low (e.g., a zero or negative) supply voltage. Forinstance, to write a logic “0,” cell bottom 215 may be taken low, thatis, the voltage of digit line 115-a may be driven to the low supplyvoltage. And to write a logic “1,” cell bottom 215 may be takenhigh—e.g., the voltage of digit line 115-a may be driven to the highsupply voltage. Read and write operations of capacitor 205 may accountfor the non-linear properties associated with a ferroelectric device.

FIG. 3 illustrates examples of such non-linear properties withhysteresis curves 300-a and 300-b for a ferroelectric memory cell thatsupports a reduced power sensing scheme in accordance with variousembodiments of the present disclosure. Hysteresis curves 300-a and 300-billustrate an example ferroelectric memory cell writing and readingprocess, respectively. Hysteresis curves 300 depict the charge, Q,stored on a ferroelectric capacitor (e.g., capacitor 205 of FIG. 2) as afunction of a voltage, V.

A ferroelectric material is characterized by a spontaneous electricpolarization, i.e., it maintains a non-zero electric polarization in theabsence of an electric field. Example ferroelectric materials includebarium titanate (BaTiO₃), lead titanate (PbTiO₃), lead zirconiumtitanate (PZT), and strontium bismuth tantalate (SBT). The ferroelectriccapacitors described herein may include these or other ferroelectricmaterials. Electric polarization within a ferroelectric capacitorresults in a net charge at the ferroelectric material's surface andattracts opposite charge through the capacitor terminals. Thus, chargeis stored at the interface of the ferroelectric material and thecapacitor terminals. Because the electric polarization may be maintainedin the absence of an externally applied electric field for relativelylong times, even indefinitely, charge leakage may be significantlydecreased as compared with, for example, capacitors employed in DRAMarrays. This may reduce the need to perform refresh operations asdescribed above for some DRAM architectures.

Hysteresis curves 300 may be understood from the perspective of a singleterminal of a capacitor. By way of example, if the ferroelectricmaterial has a negative polarization, positive charge will accumulate atthe terminal. Likewise, if the ferroelectric material has a positivepolarization, negative charge will accumulate at the terminal.Additionally, it should be understood that the voltages in hysteresiscurves 300 represent a voltage difference across the capacitor and aredirectional. For example, a positive voltage may be applied by applyinga positive voltage to the terminal in question (e.g., cell plate 230)and maintaining the second terminal at ground (e.g., cell bottom 215). Anegative voltage may be applied by maintaining the terminal in questionat ground and applying a positive voltage to the second terminal—i.e.,positive voltages may be applied to negatively polarize the terminal inquestion. Similarly, two positive voltages, two negative voltages, orany combination of positive and negative voltages may be applied to theappropriate capacitor terminals to generate the voltage difference shownin hysteresis curves 300.

As depicted in hysteresis curve 300-a, the ferroelectric material maymaintain a positive or negative polarization with a zero voltagedifference, resulting in two possible charged states: charge state 305and charge state 310. According to the example of FIG. 3, charge state305 represents a logic “0” and charge state 310 represents a logic “1.”In some examples, the logic values of the respective charge states maybe reversed to accommodate other schemes for operating a ferroelectricmemory cell.

A logic “0” or “1” may be written to the ferroelectric memory cell bycontrolling the electric polarization of the ferroelectric material, andthus the charge on the capacitor terminals, by applying voltage. Forexample, applying a net positive voltage 315 across the capacitor—e.g.,applying a greater voltage to cell plate 230 than to cell bottom 215 asdescribed with reference to FIG. 2—results in charge accumulation untilcharge state 305-a is reached. Upon removing voltage 315, charge state305-a follows path 320 until it reaches charge state 305 at zero voltagepotential. Similarly, charge state 310 is written by applying a netnegative voltage 325, which results in charge state 310-a. Afterremoving negative voltage 325, charge state 310-a follows path 330 untilit reaches charge state 310 at zero voltage.

To read, or sense, the stored state of the ferroelectric capacitor, avoltage may be applied across the capacitor. In response, the storedcharge changes, and the degree of the change depends on the initialcharge state—i.e., the degree to which the stored charge of thecapacitor changes varies depending on whether charge state 305-b or310-b was initially stored. For example, hysteresis curve 300-billustrates two possible stored charge states 305-b and 310-b. Voltage335 may be applied to the cell plate (e.g., cell plate 230 withreference to FIG. 2) of the capacitor. Although depicted as a positivevoltage, voltage 335 may be negative. In response to voltage 335, chargestate 305-b may follow path 340. Likewise, if charge state 310-b wasinitially stored, then it follows path 345. The final position of chargestate 305-c and charge state 310-c may depend on a number of factors,including the specific sensing operation and circuitry.

In some cases, the final charge may depend on the intrinsic capacitanceof the digit line of a ferroelectric memory cell. For example, if thecapacitor is electrically connected to the digit line and voltage 335 isapplied, the voltage of the digit line may rise due to its intrinsiccapacitance, and the voltage measured at a sensing component may dependon the resulting voltage of the digit line. The position of final chargestates 305-c and 310-c on hysteresis curve 300-b may thus depend on thecapacitance of the digit line and may be determined through a load-lineanalysis—i.e., charge states 305-c and 310-c may be defined with respectto the digit line capacitance. As a result, the voltage across thecapacitor, voltage 350 or voltage 355, may be different and may dependon the initial state of the capacitor. With regard to a moving platescheme, voltage 335 may be ramped from a zero voltage to a read voltage,triggering the capacitor to share its charge with a corresponding digitline.

A fixed plate scheme may apply a constant voltage 335, and thecorresponding digit line may be virtually grounded prior to accessingthe capacitor, triggering the capacitor to share its charge with thecorresponding digit line. As discussed above, the capacitor may retainone of two logic states associated with charge state 305-b or 310-b,while a zero voltage is applied across the capacitor. Therefore, if avoltage across the capacitor is maintained at a zero voltage during aread operation, the stored state may not be destroyed during the readoperation. In some examples, a ferroelectric memory device may takeadvantage of this characteristic to read a first subset of ferroelectricmemory cells selected using a common word line. For example, aferroelectric memory device may refrain from virtually grounding a digitline corresponding to a second subset of the selected ferroelectricmemory cells so that a zero voltage difference is maintained across thecapacitor. So the capacitor may maintain its initial charge state (e.g.,charge state 305-b or 310-b), and therefore, the memory device mayrefrain from activating a set of sensing components corresponding to thesecond subset of the selected ferroelectric memory cells, conservingpower.

By comparing the difference of the voltage applied to the cell plate(e.g., voltage 335) and the voltage across the capacitor (e.g., voltage350 or voltage 355) to a reference voltage, the initial state of thecapacitor may be determined. As can be understood by reference to FIG.2, the voltage of the digit line may be represented as the difference ofthe voltage applied to plate line 210 and the resulting voltage acrossthe capacitor 205. As discussed above, the voltage of the digit line isbased at least in part on the change in charge stored at the capacitor,and the change in charge is associated with the magnitude of the voltagethat is applied across the capacitor. In some examples, the referencevoltage may be an average of the digit line voltages that result fromvoltages 350 and 355, and, upon comparison, the sensed digit linevoltage may be determined to be higher or lower than the referencevoltage. A value of the ferroelectric cell (i.e., a logic “0” or “1”)may then be determined based on the comparison.

As discussed above, a ferroelectric memory cell, however, may maintainthe initial logic state after a read operation. For example, if chargestate 305-b is stored and the read operation performed, the charge statemay follow path 340 to charge state 305-c, and after removing voltage335, the charge state may return to initial charge state 305-b, forexample, by following path 340 in the opposite direction.

FIG. 4 illustrates an example circuit 400 that supports a reduced powersensing scheme in accordance with various embodiments of the presentdisclosure. Circuit 400 includes ferroelectric memory cells 105-b to105-e, word line 110-b (which may also be referred to as access line110-b), digit lines 115-b to 115-e, sensing components 125-b to 125-e,and memory controller 140-a which may be examples of a ferroelectricmemory cell 105, word line 110, digit line 115, sensing component 125,and memory controller 140-a, respectively, as described with referenceto FIGS. 1 and 2. Circuit 400 may also include plate line 210-a, whichmay be an examples of a plate line 210 as described with reference toFIG. 2. Circuit 400 also includes switching components 405-a to 405-d,plate switching components 410-a to 410-d, control lines 415-a to 415-d,and virtual ground 420.

Ferroelectric memory cells 105-b to 105-e may each include a logicstoring component, such as a ferroelectric capacitor, and a selectioncomponent, as described with reference to FIG. 2. Ferroelectric memorycells 105-b to 105-e may also be in electronic communication with plateline 210-a, which may be used to bias a cell plate (e.g., cell plate 230as described with reference to FIG. 2) of the ferroelectric capacitorfor each of ferroelectric memory cells 105-b to 105-e. In some cases, apredetermined voltage may be constantly applied to plate line 210-a, forexample in the case of a memory device using a fixed plate scheme. Eachof ferroelectric memory cells 105-b to 105-e may be in electroniccommunication with word line 110-b, which may be used to accessferroelectric memory cells 105-b to 105-e (e.g., for a read operation).For instance, by applying a voltage to word line 110-b. In some cases,the voltage applied to word line 110-b may establish a conductive pathbetween the cell bottom (e.g., cell bottom 215 as described withreference to FIG. 2) of the ferroelectric capacitor for each offerroelectric memory cells 105-b to 105-e and the corresponding digitlines 115-b to 115-e.

Digit lines 115-b to 115-e may each have intrinsic capacitances, whichmay not be electrical devices—i.e., may not be two-terminalcapacitors—but instead may depend on physical characteristics of digitlines 115-b to 115-e (e.g., trace width, trace length, etc.). Digitlines 115-b to 115-e may each be connected to virtual ground 420 viaswitching components 405-a to 405-d, respectively. Virtual ground 420may act as a common reference for circuit 400 and may also be referredto as ground or associated with a zero voltage, although, the virtualground may float to a voltage that is different than (e.g., greater orless than) zero volts when referenced to an earth ground. In some cases,digit lines 115-b to 115-d are virtually grounded prior to performing asensing operation. Digit lines 115-b to 115-e may also be connected toplate line 210-a via plate switching components 410-a to 410-d,respectively. Connecting digit lines 115-b to 115-e to plate line 210-amay bias digit line 115-b to 115-e at the voltage of plate line 210-a.Additionally or alternatively, a switching component between a first anda second digit line may be used to produce a voltage that is at or nearthe voltage of plate line 210-a. For instance, a digit line, such asdigit lines 115-b to 115-e, may be driven to a low voltage (e.g.,virtual ground) and a reference digit line may be driven to a highvoltage (e.g., a sensing voltage); the digit lines may then be shortedtogether via the switching component to produce the voltage at or nearthe voltage of plate line 210-a.

Digit lines 115-b to 115-e may also be in electronic communication withsensing components 125-b to 125-e, respectively. Sensing components125-b to 125-e may be used to determine the stored state ofcorresponding ferroelectric memory cells 105-b to 105-e. In some cases,each of sensing components 125-b to 125-e may be or may include a senseamplifier. Sensing components 125-b to 125-e may be operated by avoltage source associated with a low voltage (e.g., virtual ground, anegative voltage, etc.) and voltage source associated with a highervoltage (e.g., a positive voltage, a sensing voltage, etc.). Sensingcomponents 125-b to 125-e may be used to determine a logic value of thecorresponding ferroelectric memory cell 105-b to 105-e based at least inpart on the voltage of the corresponding digit lines 115-b to 115-e andthe voltage of a reference line (e.g., reference line 225 as discussedwith reference to FIG. 2). In some examples, sensing components 125-b to125-e are activated, which may be referred as being “fired,” to triggera comparison between the voltage of digit line 115-b and the voltage ofthe reference line. Sensing components 125-b to 125-e may latch theoutput of a sense amplifier to the voltage provided by either the highor the low voltage. For instance, if the voltage of digit line 115-b isgreater than the reference voltage, then sensing component 125-b maylatch the output of the sense amplifier at a positive voltage suppliedfrom the higher voltage source.

In some examples, sensing components 125-b to 125-e may be associatedwith sets of sensing components. For instance, sensing component 125-bmay be associated with a first set, sensing component 125-c with asecond set, sensing component 125-d with a third set, and sensingcomponent 125-e with a fourth set. Sensing components 125 from the setsmay then be arranged in an interleaved pattern to reduce pattern noise.For example, sensing components from the first set (e.g., sensingcomponent 125-b) may be adjacent to sensing components from the secondset (e.g., sensing component 125-c) and the fourth set (e.g., sensingcomponent 125-e), sensing components from the second set (e.g., sensingcomponent 125-b) may be adjacent to sensing components from the firstset (e.g., sensing component 125-b) and the third set (e.g., sensingcomponent 125-d), etc. In other examples, sensing components 125-b and125-d may be associated with a first set, while sensing components 125-cand 125-e may be associated with a second set. Similarly sensingcomponents of the first set may be interleaved with sensing componentsof the second set.

Memory controller 140-a may use control lines 415-a to 415-d to carrysignals for activating/deactivating switching components 405-a to 405-d,plate switching components 410-a to 410-d, and sensing components 125-bto 125-e. In some examples, plate switching components 410-a to 410-dmay be optionally implemented in example circuit 400. Each control line415 may be associated with multiple control lines. For instance, controlline 415-a may include a first control line used to activate/deactivatesensing component 125-b, a second control line to activate/deactivateswitching component 405-a, and a third control line toactivate/deactivate switching component 410-a. In some cases, controllines 415-a and 415-c may share a common node and control lines 415-band 415-d may also share a common node. That is, if a voltage is appliedto control line 415-a, that same voltage may also be applied to controlline 415-c, and if a voltage is applied to control line 415-b, that samevoltage may also be applied control line 415-d. In this way, memorycontroller 140-a may independently activate sensing components 125-b to125-e in an interleaved fashion. For example, sensing components 125-band 125-d may be activated while sensing components 125-c and 125-e aredeactivated. In examples where each control line 415-a to 415-d isindependent of one another, memory controller 140-a may activate sensingcomponents (e.g., sensing component 125-b) from one sensing componentset, while sensing components (e.g., sensing component 125-c to 125-e)from each of the other sensing component sets are deactivated.

In certain examples, a subset of the information stored by ferroelectricmemory cells 105-b to 105-e may be used by a program (e.g., softwareapplication, hardware driver, etc.) that triggers a read operation. Butto select any of ferroelectric memory cells 105-b to 105-e, a voltagemay be applied to word line 110-b, and as discussed above, applying avoltage to word line 110-b may result in a conductive path beingestablished between the ferroelectric capacitors of each offerroelectric memory cells 105-b to 105-e and the corresponding digitline 115-b to 115-e. Due to the properties of a ferroelectric capacitor,the ferroelectric capacitors of ferroelectric memory cells 105-b to105-e may not discharge onto digit lines 115-b to 115-e if a voltagethat is at or near the voltage applied to plate line 210-a is alsopresent on the digit lines 115-b to 115-e. Therefore, memory controller140-a may virtually ground a first subset of digit lines 115-b to 115-eand activate the corresponding first subset of sensing components 125-bto 125-e, where the first digit lines subset corresponds to a firstsubset of ferroelectric memory cells 105-b to 105-e requested by theread operation. The memory controller may maintain other digit linesubset(s) at or near the plate voltage and other sensing componentssubset(s) in a deactivated state during the read operation, conservingpower.

In some cases, ferroelectric memory cells 105-b and 105-d may correspondto a first set of ferroelectric memory cells, ferroelectric memory cells105-c and 105-e may correspond to a second set of ferroelectric memorycells. In other cases, ferroelectric memory cell 105-b may correspond toa first set of ferroelectric memory cells, ferroelectric memory cell105-c may correspond to a second set of ferroelectric memory cells, etc.In some examples, switching components 405-a to 405-d are referred to aslinear equalization devices. Switching components 405-a to 405-d andplate switching components 410-a to 410-d may be implemented astransistors (e.g., an n or p-type FET) and may be activated/deactivatedby applying increasing or reducing a control signal, or an amplifiedversion of the control signal, to a gate of the transistor. In someexamples, switching components 405 and 410 may be implemented as asingle device (e.g., a single pole double throw switch). Circuit 400 mayalso include external/internal voltage source(s), amplifier(s), or linedriver(s), which may be used to apply voltages to plate line 210-a, wordline 110-a, switching component 405, and/or switching components 410.

FIG. 5 illustrates a timing diagram 500 for a reduced power sensingscheme in accordance with various embodiments of the present disclosure.Timing diagram 500 depicts voltage on axis 505 and time on axis 510. Thevoltage of various components as a function of time may thus berepresented on timing diagram 500. For example, timing diagram 500includes word line voltage 515, plate line voltage 520, equalizationvoltages 525-a and 525-b, and digit line voltages 530-a and 530-b.Timing diagram 500 may also include fixed voltage 535, sensing voltage540, and firing time 545. Timing diagram 500 depicts an exampleoperation of circuit 400 described with reference to FIG. 4. FIG. 5 isdescribed below with reference to components of preceding figures.Voltages that approach zero may be offset from axis 510 for ease ofrepresentation; in some cases, these voltages may be equal to orapproximately equal to zero.

As discussed with reference to FIG. 4, the digit line voltages 530 foreach digit line 115-b to 115-e may be at or near fixed voltage 535,where fixed voltage 535 may associated with a constant voltage that isapplied to plate line 210-a. In some cases, ferroelectric memory cells105-b and 105-d may correspond to a first set of ferroelectric memorycells and ferroelectric memory cells 105-c and 105-e may correspond to asecond set of ferroelectric memory cells. In the example of FIG. 5, thefirst set of ferroelectric memory cells 105-b and 105-d and the secondset of ferroelectric memory cells 105-c and 105-e may be selected for aread operation. A device may determine that the program triggering theread operation has only requested the information stored by the firstset of ferroelectric memory cells 105-b and 105-d. Accordingly, inpreparation for the read operation, memory controller 140-a may applyequalization voltage 525-a to a first set of switching components 405-aand 405-c, driving the digit line voltage 530-a toward virtual ground.Digit line voltage 530-a may be associated with a first set of digitlines 115-b and 115-d. Memory controller 140-a may concurrently remove avoltage applied to plate switching components 410-a and 410-c to isolatethe first set of digit lines 115-b and 115-d from plate line 210-a.

Memory controller 140-a may concurrently maintain the equalizationvoltage 525-b applied to a second set of switching components 405-b and405-d and may also maintain the maintain the voltage applied to plateswitching components 410-b and 410-d maintaining the connection betweenplate line 210-a and digit lines 115-c and 115-e. As a result, digitline voltage 530-d may remain at or near fixed voltage 535. Digit linevoltage 530-d may be associated with a second set of digit lines 115-cand 115-e. Once digit line voltage 530-a has reached or is near virtualground, equalization voltage 525-a may be removed, causing a voltage ofthe second set of digit lines 115-b and 115-d to change based on otherfluctuations in the circuit 400, and word line voltage 515 may beapplied to word line 110-b. A digit line, or other component that isdisconnected from a specific voltage source, and thus susceptible tochanges in voltage caused by other fluctuations in the circuit may besaid to “float” or be “floating.” A circuit element that is isolatedfrom other elements may be referred to as floating.

Applying word line voltage 515 may establish a conductive path betweenthe cell bottom (e.g., cell bottom 215 as described with reference toFIG. 2) associated with a ferroelectric capacitor of each ferroelectricmemory cell 105-b to 105-e and each digit line 115-b to 115-e,respectively. As digit line voltage 530-d and plate voltage 520 havebeen maintained at or near fixed voltage 535, a zero voltage may beapplied across the ferroelectric capacitors of the second set offerroelectric memory cells 105-c and 105-e. Accordingly, theferroelectric capacitors of the second set of ferroelectric memory cells105-c and 105-e may refrain from charge sharing with the second set ofdigit lines 115-c and 115-e and may maintain their initial storagestate. Conversely, as the digit line voltage 530-a associated with thefirst set of digit lines 115-b and 115-d has been driven to ground andsubsequently floated, the fixed voltage 535 may be applied across theferroelectric capacitors associated with the first set of ferroelectricmemory cells 105-b and 105-d. Accordingly, the digit line voltage 530-amay rise as the ferroelectric capacitors of the first set offerroelectric memory cells 105-b and 105-d discharge onto the first setof digit lines 115-b and 115-d.

In the example depicted in FIG. 5, digit line voltage 530-a may rise toone of two voltages based on the stored state. For instance, if a logic“1” is stored by a ferroelectric capacitor of ferroelectric memory cell105-b, then digit line voltage 530-b may result, while digit linevoltage 530-c may result if a logic “0” is stored. Digit line voltage530-b may be associated with a smaller voltage drop over theferroelectric cell and therefore a higher digit line voltage whencompared with digit line voltage 530-c, as can be seen with respect toFIG. 3. After digit line voltage 530-b or 530-c has settled, the firstset of sensing components 125-b and 125-d may be activated at firingtime 545. The first set of sensing components 125-b and 125-d maycompare the digit line voltage 530 with a reference voltage and theoutput of the sensing components may be latched, accordingly. Forinstance, if a logic value “1” is stored by the ferroelectric capacitorassociated with ferroelectric memory cell 105-b, then the sensingcomponent 125-b may compare digit line voltage 530-b with the referencevoltage and may determine the digit line voltage 530-b is higher thanthe reference voltage. Therefore, the output of the sensing component125-b may be driven to a positive supply voltage and latched. In theexample depicted in FIG. 5, the digit line 115-b may also be driven tothe output of sensing component 125-b.

As discussed above, in some examples only the information stored by thefirst set of ferroelectric memory cells 105-b and 105-d is to be used,and therefore, the second set of sensing components 125-c and 125-e thatcorrespond to the second set of ferroelectric memory cells 105-c and105-e may be maintained in a deactivated state during the readoperation. Activating (or firing) a portion of the sensing components125 may conserve power during read operations. After firing the firstset of sensing components 125-b and 125-d, a write-back procedure may beperformed to restore the logic states stored by the first set offerroelectric memory cells 105-b and 105-d prior to the read operation.

In some cases, the write-back procedure may include an oppositewrite-back procedure during which the opposite state to the previouslystored state is written-back to a sensed ferroelectric memory cell 105.After write-back, the first set of digit lines 115-b and 115-d may bereturned to or near fixed voltage 535 in preparation of the next readoperation. Returning the voltage of the first set of digit lines 115-band 115-d to fixed voltage 535 may include shorting the first set ofdigit lines 115-b and 115-d to plate line 210-a. In some cases, a firstset of plate switching components 410-a and 410-c may be activated toshort the first set of digit lines 115-b and 115-d to plate line 210-a.Alternatively, the first set of digit lines 115-b and 115-d may bedriven to a high or low voltage based on the sensing operation andsubsequently shorted with the corresponding reference line, which hasbeen driven to the opposite voltage, to produce a voltage in between thehigh and low voltages (i.e., a voltage at or near fixed voltage 535).

In some examples, ferroelectric memory cells 105-b to 105-e may furtherbe broken down so that ferroelectric memory cell 105-b corresponds to afirst set of ferroelectric memory cells, ferroelectric memory cell 105-ccorresponds to a second set of ferroelectric memory cells, etc. In thisway, control over which sensing components 125-b to 125-e may beactivated/deactivated during a read with increased granularity. In somecases, the rise and fall of certain voltages may overlap with oneanother to reduce the duration associated with read/write operations.For instance, in one case, the rise of word line voltage 515 may overlapwith the descent of equalization voltage 525-a. Applying voltages, suchas equalization voltage 525-a, to a switching component, such asswitching components 405 and 410, may activate a switching component andremoving a voltage (e.g., applying a zero voltage) may deactivate aswitching component. Although, some switching components may beimplemented that operate conversely—i.e., applying a voltage deactivatesthe switching component.

FIG. 6 illustrates a block diagram 600 of an example memory controller140-b for a reduced power sensing scheme in accordance with variousembodiments of the present disclosure. Memory controller 140-b includesdrivers 605, sensing outputs 610, and equalization outputs 615. Sensingoutputs 610 may include left sensing outputs 610-a and 610-c and rightsensing outputs 610-b and 610-d. Equalization outputs 615 may includeleft equalization outputs 615-a and 615-c and right equalization outputs615-b and 615-d. Driver 605-a may be used to control left sensing output610-a and left equalization output 615-a. Driver 605-b may be used tocontrol right sensing output 610-b and right equalization output 615-b.Driver 605-c may be used to control left sensing output 610-c and leftequalization output 615-c. Driver 605-d may be used to control rightsensing output 610-d and right equalization output 615-d.

As discussed with reference to FIG. 4, driver 605-a may be used to applya voltage through left sense output 610-a to sensing component 125-b;driver 605-b may apply a voltage through right sense output 610-b tosensing component 125-c; driver 605-c may apply a voltage through leftsense output 610-c to sensing component 125-d; and driver 605-d mayapply a voltage through right sense output 610-d to sensing component125-e. Similarly, driver 605-a may be used to apply a voltage throughleft equalization output 615-a to switching component 405-a and plateswitching component 410-a; driver 605-b may apply a voltage throughright equalization output 610-b to switching component 405-b and plateswitching component 410-b; driver 605-c may apply a voltage through leftequalization output 615-c to switching component 405-c and plateswitching component 410-c; and driver 605-d may apply a voltage throughright equalization output 615-d to switching component 405-d and plateswitching component 410-d.

In some cases, the drivers 605 may be used to amplify a low voltagecontrol signal that originates in memory controller 140-b, from amicrocontroller for instance. In some cases, the control voltage may beamplified to produce a voltage that is capable of driving to a gate of atransistor used to implement a switching component. In some examples,the drivers 605 operate similarly but are implemented externally tocontroller 140-b.

In some cases, driver 605-c and 605-d, left and right sense output 610-cand 610-d, and left and right equalization output 615-c and 615-d maynot be implemented. For instance, as discussed with reference to FIG. 4,ferroelectric memory cells 105-b to 105-e may correspond to a first andsecond set of memory devices. So memory controller 140-b may use driver605-a to activate a first set of sensing components 125-b and 125-dthrough left sense output 610-a, and switching components 405-a and405-c and plate switching components 410-a and 410-c through leftequalization output 610-a. While driver 605-b may be used to activate asecond set of sensing components 125-c and 125-e through right senseoutput 610-b, and switching components 405-b and 405-d and plateswitching components 410-b and 410-d through right equalization output610-b. Furthermore, control lines 415-a and 415-c may be connected at acommon node (e.g., at left sense output 610-a and left equalizationoutput 615-a) and control line 415-b and 415-d may also be connected ata common node (e.g., at right sense output 610-b and right equalizationoutput 615-b).

FIG. 7 illustrates a block diagram 700 of a memory array 100-a thatsupports a reduced power sensing scheme in accordance with variousembodiments of the present disclosure. Memory array 100-a may bereferred to as an electronic memory apparatus and includes memorycontroller 140-c and memory cells 105-f, which may be examples of memorycontroller 140 and memory cell 105 described with reference to FIGS. 1,2, 4, and 6. Memory cells 105-f may include a first, second, third, andfourth set of memory cells that may correspond to a first, second,third, and fourth set of sensing components 125-f as discussed withreference to FIGS. 4-6. Each sensing component 125-f of the first set ofsensing components may be in electronic communication with a respectivememory cell 105-f of the first set of memory cells, and each sensingcomponent 125-f of the second set of sensing components may be inelectronic communication with a respective memory cell 105-f of thesecond set of memory cells. Digit lines 115-f may include a first,second, third, and fourth set of digit lines that correspond to a memorycell 105-f and sensing component 125-f of the first, second, third, andfourth sets of memory cells and sensing components as discussed withreference to FIGS. 4-6.

Memory controller 140-c may be operable to activate the first set ofsensing components 125-f, the second set of sensing components 125-f,the third set of sensing components 125-f, the fourth set of sensingcomponents 125-f, or any combination thereof. Memory controller 140-cmay include biasing component 710 and timing component 715 and mayoperate memory array 100-a as described in FIGS. 1-6. Memory controller140-c may be in electronic communication with word line 110-f, digitline 115-f, sense component 125-f, and plate line 210-b, which may beexamples of word line 110, digit line 115, sense component 125, andplate line 210 described with reference to FIGS. 1, 2, and 4. Biasingcomponent 710 may include or be in electronic communication with drivers(e.g., amplifiers, gate drivers, etc.) for applying voltages to othercomponents within memory array 100-a. In some cases, memory controller140-c includes a first driver that is in electronic communication withthe first set of sensing components, and a second driver that is inelectronic communication with the second set of sensing components. Eachsensing component 125-f of the first set of sensing components may be inelectronic communication with memory controller 140-c via a firstcontrol line 415-e, and each sensing component 125-f of the second setof sensing components may be in electronic communication with memorycontroller 140-c via a second control line 415-e.

Memory array 100-a may also include reference component 720, latch 725,switching component 730, and fixed voltage 735. The components of memoryarray 100-a may be in electronic communication with each other and mayperform the functions described with reference to FIGS. 1-6. In somecases, reference component 720, sense component 125-f and latch 725 arecomponents of memory controller 140-c. Switching component 730,reference component 720, and latch may include first, second, third, andfourth sets of equalization components, reference components, andlatches, respectively, as described with respect to FIGS. 4-6. In somecases, the first set of sensing components and the second set of sensingcomponents are arranged in an interleaved pattern that comprises a firstsensing component of the first set of sensing components 125-f adjacentto a first sensing component and a second sensing component of thesecond set of sensing components 125-f. This may be further applied tothe third and fourth set of sensing components 125-f—i.e., a sensingcomponent of the first set may be adjacent to a sensing component of thefourth and second set, a sensing component of the second set may beadjacent to a sensing component of the first and third set, etc.Interleaving the sensing components 125-f may reduce pattern noisebetween digit lines 115-f.

In some examples, digit line 115-f is in electronic communication withvirtual ground 420-a, sense component 125-f, and a ferroelectriccapacitor of memory cells 105-f Word line 110-f may be in electroniccommunication with memory controller 140-c and a selection component ofmemory cells 105-f Plate line 210-b may be in electronic communicationwith memory controller 140-c and a plate of a ferroelectric capacitorfor each of the first, second, third, and/or fourth sets of memory cells105-f. Sense component 125-f may be in electronic communication withmemory controller 140-c, reference line 225-a, digit line 115-f, andlatch 725. Reference component 720 may be in electronic communicationwith memory controller 140-c and reference line 225-a. Switchingcomponent 730 may be in electronic communication with memory controller140-c and digit line 115-f. Virtual ground 420-a may be in electroniccommunication with memory controller 140-c, digit line 115-f, andvirtual ground 420-a. These components may also be in electroniccommunication with other components, both inside and outside of memoryarray 100-a, not listed above, via other components, connections, orbusses.

Memory controller 140-c may be configured to activate word line 110-f,plate line 210-b, or digit line 115-f by applying voltages to thosevarious nodes. For example, biasing component 710 may be configured toapply a voltage to operate memory cells 105-f to read or write memorycells 105-f as described above. In some cases, memory controller 140-cmay include a row decoder, column decoder, or both, as described withreference to FIG. 1. This may enable memory controller 140-c to accessone or more memory cells 105. Biasing component 710 may also providevoltage potentials to reference component 720 in order to generate areference signal for sense component 125-f Additionally, biasingcomponent 710 may provide voltage potentials for the operation of sensecomponent 125-f. In some cases, memory controller 140-c may perform itsoperations using timing component 715. For example, timing component 715may control the timing of the various word line selections or platebiasing, including timing for switching and voltage application toperform the memory functions, such as reading and writing, discussedherein. In some cases, timing component 715 may control the operationsof biasing component 710.

Switching component 730 may include switching components (e.g.,switching components 405 and plate switching components 410 as describedwith reference to FIG. 4) to isolate/establish conductive paths betweendigit line 115-f and fixed voltage 735 or virtual ground 420-a. In somecases, a voltage of plate line 210-b may be at or near fixed voltage735. In other cases, fixed voltage 735 and plate line 210-b may beconnected at a common node. Switching component 730 may include a firstset of switching components 730 in electronic communication with a digitline 115-f associated with each memory cell 105-f of the first set ofmemory cells and the plate line 210-b, and a second set of switchingcomponents 730 in electronic communication with a digit line 115-fassociated with each memory cell 105-f of the second set of memory cellsand the plate line 210-b. Each switching component of the first set ofswitching components is in electronic communication with the controllervia a first control line, and wherein each switching component of thesecond set of switching components is in electronic communication withthe controller via a second control line. Sense component 125-f maycompare a signal from memory cells 105-f (through digit line 115-f) witha reference signal from reference component 720. Upon determining thelogic state, the sense component may then store the output in latch 725,where it may be used in accordance with the operations of an electronicdevice that memory array 100-a is a part.

In some cases, memory controller 140-c may use biasing component 710 toselect the first set of memory cells 105-f and the second set of memorycells 105-f for a read operation using word line 110-f that is inelectronic communication with the first set of memory cells 105-f andthe second set of memory cells 105-f. Memory controller 140-c may alsouse biasing component 710 activate the first set of sensing components125-f corresponding to the first set of memory cells 105-f for the readoperation and refrain from using biasing component 710 to maintain thesecond set of sensing components 125-f corresponding to the second setof memory cells 105-f in a deactivated state during the read operation.

Memory controller 140-c may utilize a first driver in combination withbiasing component 710 to short a digit line for each memory cell of thesecond set of memory cells with a plate line during the read operation,wherein the plate line is associated with the first set of memory cellsand the second set of memory cells. Memory controller 140-c may utilizea second driver in combination with biasing component 710 to isolate adigit line for each memory cell of the first set of memory cells fromthe plate line during the read operation. In some cases, may use biasingcomponent 710 to activate switching component 730 during the readoperation, where the first set of digit lines 115-f associated with thefirst set of memory cells 105-f are in electronic communication with aplate line via switching component 730. Memory controller 140-c may alsouse biasing component 710 to deactivate switching component 730 duringthe read operation, where the second set of digit lines 115-f associatedwith each ferroelectric memory cell 105-f of the second set of memorycells 105-f is in electronic communication with a plate line 210-b viaswitching component 730.

Memory controller 140-c may use biasing component 710 to select thethird set of ferroelectric memory cells 105-f and the fourth set offerroelectric memory cells 105-f using word line 110-f. Memorycontroller 140-c may also use biasing component 710 to activate thethird set of sensing components 125-f for the read operation.

FIG. 8 illustrates a system 800 that supports a reduced power sensingscheme in accordance with various embodiments of the present disclosure.System 800 includes a device 805, which may be or include a printedcircuit board to connect or physically support various components.Device 805 includes a memory array 100-b, which may be an example ofmemory array 100 described with reference to FIG. 1 and FIG. 7. Memoryarray 100-b may contain memory controller 140-d and memory cell(s)105-g, which may be examples of memory controller 140 described withreference to FIGS. 1 and 7 and memory cells 105 described with referenceto FIGS. 1, 2, 4, and 7. Device 805 may also include a processor 810,BIOS component 815, peripheral component(s) 820, and input/outputcontrol component 825. The components of device 805 may be in electroniccommunication with one another through bus 830.

Processor 810 may be configured to operate memory array 100-b throughmemory controller 140-d. In some cases, processor 810 may perform thefunctions of memory controller 140 described with reference to FIGS. 1,4, 6, and 7. In other cases, memory controller 140-d may be integratedinto processor 810. Processor 810 may be a general-purpose processor, adigital signal processor (DSP), an application-specific integratedcircuit (ASIC), a field-programmable gate array (FPGA) or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or it may be a combination of these types ofcomponents, and processor 810 may perform various functions describedherein, including a reduced power sensing scheme. Processor 810 may, forexample, be configured to execute computer-readable instructions storedin memory array 100-b to cause device 805 perform various functions ortasks.

BIOS component 815 may be a software component that includes a basicinput/output system (BIOS) operated as firmware, which may initializeand run various hardware components of system 800. BIOS component 815may also manage data flow between processor 810 and the variouscomponents, e.g., peripheral components 820, input/output controlcomponent 825, etc. BIOS component 815 may include a program or softwarestored in read-only memory (ROM), flash memory, or any othernon-volatile memory.

Peripheral component(s) 820 may be any input or output device, or aninterface for such devices, that is integrated into device 805. Examplesmay include disk controllers, sound controller, graphics controller,Ethernet controller, modem, universal serial bus (USB) controller, aserial or parallel port, or peripheral card slots, such as peripheralcomponent interconnect (PCI) or accelerated graphics port (AGP) slots.

Input/output control component 825 may manage data communication betweenprocessor 810 and peripheral component(s) 820, input devices 835, oroutput devices 840. Input/output control component 825 may also manageperipherals not integrated into device 805. In some cases, input/outputcontrol component 825 may represent a physical connection or port to theexternal peripheral.

Input 835 may represent a device or signal external to device 805 thatprovides input to device 805 or its components. This may include a userinterface or interface with or between other devices. In some cases,input 835 may be a peripheral that interfaces with device 805 viaperipheral component(s) 820 or may be managed by input/output controlcomponent 825.

Output 840 may represent a device or signal external to device 805configured to receive output from device 805 or any of its components.Examples of output 840 may include a display, audio speakers, a printingdevice, another processor or printed circuit board, etc. In some cases,output 840 may be a peripheral that interfaces with device 805 viaperipheral component(s) 820 or may be managed by input/output controlcomponent 825.

The components of memory controller 140-d, device 805, and memory array100-b may be made up of circuitry designed to carry out their functions.This may include various circuit elements, for example, conductivelines, transistors, capacitors, inductors, resistors, amplifiers, orother active or inactive elements, configured to carry out the functionsdescribed herein.

FIG. 9 shows a flowchart illustrating a method 900 for a reduced powersensing scheme in accordance with various embodiments of the presentdisclosure. The operations of method 900 may be implemented by a memoryarray 100, as described with reference to FIGS. 1-8. For example, theoperations of method 900 may be performed by a memory controller 140 asdescribed with reference to FIGS. 1, 4, and 6-8. In some examples, amemory controller 140 may execute a set of codes to control thefunctional elements of the memory array 100 to perform the functionsdescribed below. Additionally or alternatively, the memory controller140 may perform features the functions described below usingspecial-purpose hardware.

At block 905, the method may include selecting a first set of memorycells and a second set of memory cells for a read operation using a wordline that is in electronic communication with the first set of memorycells and the second set of memory cells. In certain examples, theoperations of block 905 may be performed or facilitated by the biasingcomponent 710, as described with reference to FIG. 7. In some examples,the word line is in electronic communication with a third set of memorycells and a fourth set of memory cells, and the method may furtherinclude selecting the third set of memory cells and the fourth set ofmemory cells using the word line.

At block 910, the method may include activating a first set of sensingcomponents corresponding to the first set of memory cells for the readoperation. In certain examples, the operations of block 910 may beperformed or facilitated by the biasing component 710, as described withreference to FIG. 7. In some cases, the method may include isolating adigit line for each memory cell of the first set of memory cells from aplate line during the read operation. Isolating the digit line for eachmemory cell may include deactivating a switching component that is inelectronic communication with the plate line and the digit line for eachmemory cell of the first set of memory cells during the read operation.In some examples, a third set of sensing components is in electroniccommunication with the third set of memory cells and a fourth set ofsensing components is in electronic communication with the fourth set ofmemory cells.

In some cases, the method may include providing a voltage to the digitline for each memory cell of the first set of memory cells before theread operation. The voltage may be equivalent to (e.g., at or near) thevoltage of the plate line. In some cases, providing a voltage to thedigit line for each memory cell of the first set of memory cells mayinclude shorting the digit line for each memory cell of the first set ofmemory cells with a corresponding first set of reference digit lines. Insome cases, the method may include virtually grounding the digit linefor each memory cell of the first set of memory cells before the readoperation and/or after providing a voltage to the digit line for eachmemory cell of the first set of memory cells.

At block 915, the method may include maintaining a second set of sensingcomponents that correspond to the second memory cell in a deactivatedstate during the read operation. In certain examples, the operations ofblock 915 may be performed or facilitated by the biasing component 710,as described with reference to FIG. 7. Each memory cell of the first setof memory cells and each memory cell of the second set of memory cellscomprises a ferroelectric capacitor. In some cases, the method mayinclude shorting a digit line for each memory cell of the second set ofmemory cells with a plate line during the read operation, wherein theplate line is in electronic communication with the first set of memorycells and the second set of memory cells. Shorting the digit line mayinclude activating a switching component that is in electroniccommunication with the plate line and a digit line for each memory cellof the second set of memory cells during the read operation. In somecases, a voltage of the plate line is a fixed voltage. In some cases,the fourth set of sensing components is maintained in the deactivatedstate during the read operation based at least in part on activating thethird set of memory cells.

In some cases, the method may include providing a voltage to the digitline for each memory cell of the second set of memory cells before theread operation. In some cases, providing a voltage to the digit line foreach memory cell of the second set of memory cells may include shortingthe digit line for each memory cell of the second set of memory cellswith a corresponding second set of reference digit lines. The first setof sensing components and the second set of sensing components may bearranged in an interleaved pattern that comprises a first sensingcomponent of the first set of sensing components adjacent to a firstsensing component and a second sensing component of the second set ofsensing components.

Thus, method 900 may provide a method of operating a ferroelectricmemory array for a reduced power sensing scheme. It should be noted thatmethod 900 describes possible implementations, and the operations andsteps may be rearranged or otherwise modified such that otherimplementations are possible.

The description herein provides examples, and is not limiting of thescope, applicability, or examples set forth in the claims. Changes maybe made in the function and arrangement of elements discussed withoutdeparting from the scope of the disclosure. Various examples may omit,substitute, or add various procedures or components as appropriate.Also, features described with respect to some examples may be combinedin other examples.

The description set forth herein, in connection with the appendeddrawings, describes example configurations and does not represent allthe examples that may be implemented or that are within the scope of theclaims. The terms “example,” “exemplary,” and “embodiment,” as usedherein, mean “serving as an example, instance, or illustration,” and not“preferred” or “advantageous over other examples.” The detaileddescription includes specific details for the purpose of providing anunderstanding of the described techniques. These techniques, however,may be practiced without these specific details. In some instances,well-known structures and devices are shown in block diagram form inorder to avoid obscuring the concepts of the described examples.

In the appended figures, similar components or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. When the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

Information and signals described herein may be represented using any ofa variety of different technologies and techniques. For example, data,instructions, commands, information, signals, bits, symbols, and chipsthat may be referenced throughout the above description may berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof. Some drawings may illustrate signals as a single signal;however, it will be understood by a person of ordinary skill in the artthat the signal may represent a bus of signals, where the bus may have avariety of bit widths.

As used herein, the term “virtual ground” refers to a node of anelectrical circuit that is held at a voltage of approximately zero volts(0V) but that is not directly connected with ground. Accordingly, thevoltage of a virtual ground may temporarily fluctuate and return toapproximately 0V at steady state. A virtual ground may be implementedusing various electronic circuit elements, such as a voltage dividerconsisting of operational amplifiers and resistors. Otherimplementations are also possible. “Virtual grounding” or “virtuallygrounded” means connected to approximately 0V.

The term “electronic communication” refers to a relationship betweencomponents that supports electron flow between the components. This mayinclude a direct connection between components or may includeintermediate components. Components in electronic communication may beactively exchanging electrons or signals (e.g., in an energized circuit)or may not be actively exchanging electrons or signals (e.g., in ade-energized circuit) but may be configured and operable to exchangeelectrons or signals upon a circuit being energized. By way of example,two components physically connected via a switch (e.g., a transistor)are in electronic communication regardless of the state of the switch(i.e., open or closed).

The term “isolated” refers to a relationship between components in whichelectrons are not presently capable of flowing between them; componentsare isolated from each other if there is an open circuit between them.For example, two components physically connected by a switch may beisolated from each other when the switch is open.

The devices discussed herein, including memory array 100, may be formedon a semiconductor substrate, such as silicon, germanium,silicon-germanium alloy, gallium arsenide, gallium nitride, etc. In somecases, the substrate is a semiconductor wafer. In other cases, thesubstrate may be a silicon-on-insulator (SOI) substrate, such assilicon-on-glass (SOG) or silicon-on-sapphire (SOP), or epitaxial layersof semiconductor materials on another substrate. The conductivity of thesubstrate, or sub-regions of the substrate, may be controlled throughdoping using various chemical species including, but not limited to,phosphorous, boron, or arsenic. Doping may be performed during theinitial formation or growth of the substrate, by ion-implantation, or byany other doping means.

A transistor or transistors discussed herein may represent afield-effect transistor (FET) and comprise a three terminal deviceincluding a source, drain, and gate. The terminals may be connected toother electronic elements through conductive materials, e.g., metals.The source and drain may be conductive and may comprise a heavily-doped,e.g., degenerate, semiconductor region. The source and drain may beseparated by a lightly-doped semiconductor region or channel. If thechannel is n-type (i.e., majority carriers are electrons), then the FETmay be referred to as an n-type FET. If the channel is p-type (i.e.,majority carriers are holes), then the FET may be referred to as ap-type FET. The channel may be capped by an insulating gate oxide. Thechannel conductivity may be controlled by applying a voltage to thegate. For example, applying a positive voltage or negative voltage to ann-type FET or a p-type FET, respectively, may result in the channelbecoming conductive. A transistor may be “on” or “activated” when avoltage greater than or equal to the transistor's threshold voltage isapplied to the transistor gate. The transistor may be “off” or“deactivated” when a voltage less than the transistor's thresholdvoltage is applied to the transistor gate.

The various illustrative blocks, components, and modules described inconnection with the disclosure herein may be implemented or performedwith a general-purpose processor, a DSP, an ASIC, an FPGA or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or any combination thereof designed to perform thefunctions described herein. A general-purpose processor may be amicroprocessor, but in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of computing devices(e.g., a combination of a DSP and a microprocessor, multiplemicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other such configuration).

The functions described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof. Ifimplemented in software executed by a processor, the functions may bestored on or transmitted over as one or more instructions or code on acomputer-readable medium. Other examples and implementations are withinthe scope of the disclosure and appended claims. For example, due to thenature of software, functions described above can be implemented usingsoftware executed by a processor, hardware, firmware, hardwiring, orcombinations of any of these. Features implementing functions may alsobe physically located at various positions, including being distributedsuch that portions of functions are implemented at different physicallocations. Also, as used herein, including in the claims, “or” as usedin a list of items (for example, a list of items prefaced by a phrasesuch as “at least one of” or “one or more of”) indicates an inclusivelist such that, for example, a list of at least one of A, B, or C meansA or B or C or AB or AC or BC or ABC (i.e., A and B and C).

Computer-readable media includes both non-transitory computer storagemedia and communication media including any medium that facilitatestransfer of a computer program from one place to another. Anon-transitory storage medium may be any available medium that can beaccessed by a general purpose or special purpose computer. By way ofexample, and not limitation, non-transitory computer-readable media cancomprise RAM, ROM, electrically erasable programmable read only memory(EEPROM), compact disk (CD) ROM or other optical disk storage, magneticdisk storage or other magnetic storage devices, or any othernon-transitory medium that can be used to carry or store desired programcode means in the form of instructions or data structures and that canbe accessed by a general-purpose or special-purpose computer, or ageneral-purpose or special-purpose processor.

Also, any connection is properly termed a computer-readable medium. Forexample, if the software is transmitted from a website, server, or otherremote source using a coaxial cable, fiber optic cable, twisted pair,digital subscriber line (DSL), or wireless technologies such asinfrared, radio, and microwave, then the coaxial cable, fiber opticcable, twisted pair, digital subscriber line (DSL), or wirelesstechnologies such as infrared, radio, and microwave are included in thedefinition of medium. Disk and disc, as used herein, include CD, laserdisc, optical disc, digital versatile disc (DVD), floppy disk, andBlu-ray disc where disks usually reproduce data magnetically, whilediscs reproduce data optically with lasers. Combinations of the aboveare also included within the scope of computer-readable media.

The description herein is provided to enable a person skilled in the artto make or use the disclosure. Various modifications to the disclosurewill be readily apparent to those skilled in the art, and the genericprinciples defined herein may be applied to other variations withoutdeparting from the scope of the disclosure. Thus, the disclosure is notto be limited to the examples and designs described herein but is to beaccorded the broadest scope consistent with the principles and novelfeatures disclosed herein.

What is claimed is:
 1. A method of operating a ferroelectric memoryarray, comprising: selecting a first set of memory cells and a secondset of memory cells for a read operation using a word line that is inelectronic communication with the first set of memory cells and thesecond set of memory cells, wherein each memory cell of the first set ofmemory cells and each memory cell of the second set of memory cellscomprises a ferroelectric capacitor; activating a first set of sensingcomponents corresponding to the first set of memory cells for the readoperation; and maintaining a second set of sensing components thatcorrespond to the second set of memory cells in a deactivated stateduring the read operation.
 2. The method of claim 1, further comprising:shorting a digit line for each memory cell of the second set of memorycells with a plate line during the read operation, wherein the plateline is in electronic communication with the first set of memory cellsand the second set of memory cells.
 3. The method of claim 2, whereinthe digit line for each memory cell of the second set of memory cells isin electronic communication with the plate line via a switchingcomponent, and wherein shorting the digit line comprises: activating theswitching component during the read operation.
 4. The method of claim 2,wherein a voltage of the plate line is a fixed voltage.
 5. The method ofclaim 1, further comprising: isolating a digit line for each memory cellof the first set of memory cells from a plate line during the readoperation.
 6. The method of claim 5, wherein the digit line for eachmemory cell of the first set of memory cells is in electroniccommunication with the plate line via a switching component, and whereinisolating the digit line for each memory cell comprises: deactivatingthe switching component during the read operation.
 7. The method ofclaim 1, wherein the word line is in electronic communication with athird set of memory cells and a fourth set of memory cells, and whereinthe method further comprises: selecting the third set of memory cellsand the fourth set of memory cells using the word line.
 8. The method ofclaim 7, wherein a third set of sensing components is in electroniccommunication with the third set of memory cells and a fourth set ofsensing components is in electronic communication with the fourth set ofmemory cells, and wherein the method further comprises: activating thethird set of sensing components for the read operation.
 9. The method ofclaim 8, further comprising: maintaining the fourth set of sensingcomponents in the deactivated state during the read operation based atleast in part on activating the third set of memory cells.
 10. Themethod of claim 1, wherein the first set of sensing components and thesecond set of sensing components are arranged in an interleaved patternthat comprises a first sensing component of the first set of sensingcomponents adjacent to a first sensing component and a second sensingcomponent of the second set of sensing components.
 11. An electronicmemory apparatus, comprising: a first set of memory cells correspondingto a first set of sensing components, a second set of memory cellscorresponding to a second set of sensing components, wherein each memorycell of the first set of memory cells and the second set of memory cellscomprises a ferroelectric capacitor; a word line in electroniccommunication with the first set of memory cells and the second set ofmemory cells; and a controller in electronic communication with thefirst set of sensing components and the second set of sensingcomponents, wherein the controller is operable to activate the first setof sensing components and the second set of sensing componentsindependently of one another.
 12. The electronic memory apparatus ofclaim 11, wherein the controller comprises: a first driver that is inelectronic communication with the first set of sensing components; and asecond driver that is in electronic communication with the second set ofsensing components.
 13. The electronic memory apparatus of claim 11,wherein each sensing component of the first set of sensing components isin electronic communication with the controller via a first controlline, and wherein each sensing component of the second set of sensingcomponents is in electronic communication with the controller via asecond control line.
 14. The electronic memory apparatus of claim 11,wherein the first set of sensing components and the second set ofsensing components are arranged in an interleaved pattern that comprisesa first sensing component of the first set of sensing componentsadjacent to a first sensing component and a second sensing component ofthe second set of sensing components.
 15. The electronic memoryapparatus of claim 11, further comprising: a plate line in electroniccommunication with the first set of memory cells and the second set ofmemory cells.
 16. The electronic memory apparatus of claim 15, furthercomprising: a first set of switching components in electroniccommunication with a digit line associated with each memory cell of thefirst set of memory cells and the plate line; and a second set ofswitching components in electronic communication with a digit lineassociated with each memory cell of the second set of memory cells andthe plate line.
 17. The electronic memory apparatus of claim 16, whereineach switching component of the first set of switching components is inelectronic communication with the controller via a first control line,and wherein each switching component of the second set of switchingcomponents is in electronic communication with the controller via asecond control line.
 18. The electronic memory apparatus of claim 11,wherein each sensing component of the first set of sensing components isin electronic communication with a respective memory cell of the firstset of memory cells and each sensing component of the second set ofsensing components is in electronic communication with a respectivememory cell of the second set of memory cells.
 19. The electronic memoryapparatus of claim 11, further comprising: a third set of memory cellscorresponding to a third set of sensing components, a fourth set ofmemory cells corresponding to a fourth set of sensing components;wherein: the word line is in electronic communication with the third setof memory cells and the fourth set of memory cells, the controller is inelectronic communication with the third set of sensing components andthe fourth set of sensing components, and the controller is operable toactivate the first set of sensing components, the second set of sensingcomponents, the third set of sensing components, and the fourth set ofsensing components independently of one another.
 20. An electronicmemory apparatus, comprising: a first set of memory cells; a second setof memory cells; a first set of sensing components; a second set ofsensing components; and a controller in electronic communication withthe first set of memory cells, the second set of memory cells, the firstset of sensing components, and the second set of sensing components,wherein the controller is operable to: select the first set of memorycells and the second set of memory cells for a read operation using aword line that is in electronic communication with the first set ofmemory cells and the second set of memory cells; activate the first setof sensing components corresponding to the first set of memory cells forthe read operation; and maintain the second set of sensing componentscorresponding to the second set of memory cells in a deactivated stateduring the read operation.
 21. The electronic memory apparatus of claim20, further comprising a first driver and a second driver, wherein thefirst driver is operable to: short a digit line for each memory cell ofthe second set of memory cells with a plate line during the readoperation, wherein the plate line is associated with the first set ofmemory cells and the second set of memory cells, and wherein the seconddriver is operable to: isolate a digit line for each memory cell of thefirst set of memory cells from the plate line during the read operation.22. The electronic memory apparatus of claim 20, further comprising: aswitching component; and a digit line associated with each memory cellof the first set of memory cells that is in electronic communicationwith a plate line via the switching component, wherein the controller isoperable to: activate the switching component during the read operation.23. The electronic memory apparatus of claim 20, further comprising: aswitching component; and a digit line associated with each ferroelectricmemory cell of the second set of memory cells that is in electroniccommunication with a plate line via the switching component, wherein thecontroller is operable to: deactivate the switching component during theread operation.
 24. The electronic memory apparatus of claim 20, furthercomprising: a third set of memory cells; and a fourth set of memorycells, wherein the controller is operable to: select the third set ofmemory cells and the fourth set of memory cells using the word line. 25.The electronic memory apparatus of claim 24, further comprising: a thirdset of sensing components corresponding to the third set of memorycells, wherein the controller is operable to: activate the third set ofsensing components for the read operation.
 26. The electronic memoryapparatus of claim 24, wherein the first set of sensing components andthe second set of sensing components are arranged in an interleavedpattern that comprises a first sensing component of the first set ofsensing components adjacent to a first sensing component and a secondsensing component of the second set of sensing components.